The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2024

Filed:

Feb. 28, 2022
Applicants:

Qing Ding Precision Electronics (Huaian) Co., Ltd, Huai an, CN;

Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;

Inventors:

Jun Dai, Qinhuangdao, CN;

Mei Yang, Qinhuangdao, CN;

Ming-Jaan Ho, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/54 (2006.01); H04N 5/225 (2006.01); H04N 23/54 (2023.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H04N 23/55 (2023.01);
U.S. Cl.
CPC ...
H04N 23/54 (2023.01); H04N 23/55 (2023.01); H05K 1/0306 (2013.01); H05K 1/111 (2013.01); H05K 1/0393 (2013.01);
Abstract

A camera module includes a holder, a lens in the holder, magnets disposed on an outer wall of the holder, and a circuit board assembly. The circuit board assembly includes an outer wiring substrate, and first and second inner wiring substrates spaced out on a surface of the outer wiring substrate. The first inner wiring substrate surrounds the holder and includes a first dielectric layer and a first inner wiring layer thereon. The first inner wiring layer includes coils of wound wire in the first inner wiring layer, and each of the coils corresponds to one of the magnets. The second inner wiring substrate includes a second inner wiring layer, a thickness of each of the coils is greater than a thickness of the second inner wiring layer. A method for manufacturing the camera module is also disclosed.


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