The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2024
Filed:
May. 31, 2022
Gowin Semiconductor Corporation, Ltd., GuangZhou, CN;
Grant Thomas Jennings, Austin, TX (US);
Jinghui Zhu, San Jose, CA (US);
GOWIN Semiconductor Corporation, Ltd., GuangZhou, CN;
Abstract
An integrated circuit ('IC') module includes a substrate, multiple field-programmable gate array (“FPGA”) dies, and pads capable of being selectively configured to perform one or more user defined logic functions. The substrate is configured to house multiple FPGA dies side-by-side in an array formation facilitating transmission of signals between the FPGA dies or chips. The FPGA dies are placed on the substrate functioning as a single FPGA device. The periphery dies of the FPGA dies are configured for external connectivity and the interior dies which are interconnected to perform user defined logic functions. The pads, in one aspect, coupling to the FPGA dies, are configured to provide connections between at least some of the FPGA dies.