The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2024
Filed:
Apr. 03, 2020
Boe Technology Group Co., Ltd., Beijing, CN;
Liang Chen, Beijing, CN;
Lei Wang, Beijing, CN;
Minghua Xuan, Beijing, CN;
Dongni Liu, Beijing, CN;
Li Xiao, Beijing, CN;
Detao Zhao, Beijing, CN;
Hao Chen, Beijing, CN;
BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;
Abstract
Provided is a method for transferring a chip, including: disposing a target substrate in a sealed chamber; applying charges of different polarities to a first alignment bonding structure of the target substrate and a first chip bonding structure of the chip, and injecting an insulation fluid flowing in a first direction into the sealed chamber, so that the first chip bonding structure is aligned with the first alignment bonding structure; applying charges of different polarities to a second alignment bonding structure of the target substrate and a second chip bonding structure of the chip, and changing the flowing direction of the insulation fluid to a second direction, so that the second chip bonding structure is aligned with the second alignment bonding structure; and applying a bonding force to the chip, so that the chip bonding structures is bonded to the alignment bonding structures.