The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2024

Filed:

Aug. 09, 2021
Applicant:

Epistar Corporation, Hsinchu, TW;

Inventors:

Chien-Fu Huang, Hsinchu, TW;

Chih-Chiang Lu, Hsinchu, TW;

Chun-Yu Lin, Hsinchu, TW;

Hsin-Chih Chiu, Hsinchu, TW;

Assignee:

EPISTAR CORPORATION, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/02 (2010.01); H01L 33/62 (2010.01); H01L 25/075 (2006.01); H01L 21/66 (2006.01); H01L 23/00 (2006.01); H01L 33/36 (2010.01);
U.S. Cl.
CPC ...
H01L 33/02 (2013.01); H01L 22/12 (2013.01); H01L 22/14 (2013.01); H01L 24/24 (2013.01); H01L 25/0753 (2013.01); H01L 33/62 (2013.01); H01L 33/36 (2013.01); H01L 2924/0002 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01);
Abstract

The present disclosure provides a light-emitting device comprising a substrate with a topmost surface; a first semiconductor stack arranged on the substrate, and comprising a first top surface separated from the topmost surface by a first distance; a first bonding layer arranged between the substrate and the first semiconductor stack; a second semiconductor stack arranged on the substrate, and comprising a second top surface separated from the topmost surface by a second distance which is different form the first distance; a second bonding layer arranged between the substrate and the second semiconductor stack; a third semiconductor stack arranged on the substrate, and comprising third top surface separated from the topmost surface by a third distance; and a third bonding layer arranged between the substrate and the third semiconductor stack; wherein the first semiconductor stack, the second semiconductor stack, and the third semiconductor stack are configured to emit different color lights.


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