The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2024
Filed:
Oct. 13, 2022
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Masaki Haneda, Kanagawa, JP;
SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa, JP;
Abstract
There is provided a semiconductor device in which the inter-wiring capacitance of wiring lines provided in any layout is further reduced. A semiconductor device that includes a first inter-wiring insulating layer that is provided on a substrate and includes a recess on a side opposite to the substrate, a first wiring layer that is provided inside the recess in the first inter-wiring insulating layer, a sealing film that is provided along an uneven shape of the first wiring layer and the first inter-wiring insulating layer, a second inter-wiring insulating layer that is provided on the first inter-wiring insulating layer to cover the recess, and a gap that is provided between the second inter-wiring insulating layer and the first wiring layer and the first inter-wiring insulating layer. The second inter-wiring insulating layer has a planarized surface that is opposed to the recess.