The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2024

Filed:

Jan. 06, 2022
Applicant:

Immunolight, Llc, Detroit, MI (US);

Inventors:

Zakaryae Fathi, Raleigh, NC (US);

James Clayton, Detroit, MI (US);

Harold Walder, Oak Island, NC (US);

Frederic A. Bourke, Jr., Aspen, CO (US);

Assignee:

IMMUNOLIGHT, LLC, Detroit, MI (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/00 (2018.01); H01L 23/00 (2006.01); B41J 2/175 (2006.01); C09J 4/00 (2006.01); A61B 17/00 (2006.01); A61L 24/06 (2006.01); B32B 37/12 (2006.01); B32B 37/18 (2006.01); B32B 38/00 (2006.01); C09J 133/08 (2006.01); C09K 11/02 (2006.01); C09K 11/77 (2006.01); H01L 25/065 (2023.01); H01L 25/00 (2006.01); B32B 3/26 (2006.01); B32B 7/14 (2006.01); B32B 9/04 (2006.01); C09J 9/02 (2006.01); C09J 11/04 (2006.01); C09J 11/06 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); A61B 17/0057 (2013.01); A61L 24/06 (2013.01); B32B 3/266 (2013.01); B32B 7/14 (2013.01); B32B 9/04 (2013.01); B32B 37/1284 (2013.01); B32B 37/18 (2013.01); B32B 38/0008 (2013.01); B41J 2/17559 (2013.01); C08K 3/00 (2013.01); C09J 4/00 (2013.01); C09J 9/02 (2013.01); C09J 11/04 (2013.01); C09J 11/06 (2013.01); C09J 133/08 (2013.01); C09K 11/02 (2013.01); C09K 11/777 (2013.01); C09K 11/7769 (2013.01); H01L 23/5226 (2013.01); H01L 24/32 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); B32B 2037/1253 (2013.01); B32B 2457/00 (2013.01); B32B 2457/08 (2013.01); B32B 2457/14 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83855 (2013.01); H01L 2224/92125 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/07811 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15311 (2013.01); Y10T 428/2852 (2015.01);
Abstract

A polymerizable composition includes at least one monomer, a photoinitiator capable of initiating polymerization of the monomer when exposed to light, and a phosphor capable of producing light when exposed to radiation (typically X-rays). The material is particularly suitable for bonding components at ambient temperature in situations where the bond joint is not accessible to an external light source. An associated method includes: placing a polymerizable adhesive composition, including a photoinitiator and energy converting material, such as a down-converting phosphor, in contact with at least two components to be bonded to form an assembly; and, irradiating the assembly with radiation at a first wavelength, capable of conversion (down-conversion by the phosphor) to a second wavelength capable of activating the photoinitiator, to prepare items such as inkjet cartridges, wafer-to-wafer assemblies, semiconductors, integrated circuits, and the like.


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