The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2024
Filed:
Dec. 03, 2019
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Thomas Stoek, Buxtehude, DE;
Michael Stadler, Munich, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/495 (2006.01); H01L 21/56 (2006.01); H01L 23/373 (2006.01); H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 21/4882 (2013.01); H01L 21/565 (2013.01); H01L 23/3107 (2013.01); H01L 23/3736 (2013.01); H01L 23/49568 (2013.01); H01L 23/49861 (2013.01);
Abstract
A semiconductor package includes a semiconductor chip, an encapsulation body encapsulating the semiconductor chip, and a metal sheet having a first sheet surface and an opposite second sheet surface. The first sheet surface is exposed at the encapsulation body. The semiconductor chip is arranged at the second sheet surface. The first sheet surface has a pattern having first subdivisions having a first average roughness and second subdivisions having a second average roughness. The first average roughness is greater than the second average roughness.