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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11901211 B1

PDFFull Text
Date of Patent:
Feb. 13, 2024

Filed:

Jun. 05, 2019

Semiconductor-processing tape

Applicant:

Furukawa Electric Co., Ltd., Tokyo, JP;

Inventors:

Hirotoki Yokoi, Tokyo, JP;

Yukihiro Matsubara, Tokyo, JP;

Assignee:

FURUKAWA ELECTRIC CO., LTD., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Anish P Desai

Int. Cl.
CPC ...
H01L 21/304 (2006.01); H01L 21/683 (2006.01); B23K 26/53 (2014.01); C09J 7/24 (2018.01); C09J 7/29 (2018.01); C09J 7/38 (2018.01); H01L 21/78 (2006.01); B32B 7/10 (2006.01); C09J 201/00 (2006.01); C09J 7/20 (2018.01); B32B 27/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); B23K 26/53 (2015.10); B32B 7/10 (2013.01); B32B 27/00 (2013.01); C09J 7/20 (2018.01); C09J 7/245 (2018.01); C09J 7/29 (2018.01); C09J 7/38 (2018.01); C09J 7/385 (2018.01); C09J 201/00 (2013.01); H01L 21/304 (2013.01); H01L 21/78 (2013.01); C09J 2203/326 (2013.01); C09J 2301/414 (2020.08); C09J 2423/046 (2013.01); C09J 2433/00 (2013.01); C09J 2433/006 (2013.01); C09J 2461/00 (2013.01); C09J 2463/00 (2013.01); Y10T 428/2848 (2015.01);
Abstract

A semiconductor-processing tape, for use in dividing an adhesive layer along semiconductor chips by expansion, having a base material film, a removable adhesive layer, and an adhesive layer, in this order, wherein the base material film has the stress values in MD and TD at the time of 5%-elongation of 5 MPa or, more, the tensile strength values in MD and TD at the time of 5%-elongation of 10 to 30 N/25 mm, and the thickness of from 70 to 150 μm, and wherein the adhesive layer has a thickness of 40 μm or more and the storage elastic modulus at 25° C. of 2000 MPa or less.

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Yokoi, Hirotoki. (2024). Semiconductor-processing tape (U.S. Patent No. 11901211). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11901211

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