The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2024

Filed:

Sep. 13, 2021
Applicant:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Inventors:

Mitsuo Sano, Kamakura, JP;

Susumu Obata, Yokohama, JP;

Kazuhito Higuchi, Yokohama, JP;

Takayuki Tajima, Sagamihara, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/306 (2006.01); H01L 21/308 (2006.01); H01L 29/423 (2006.01); H01L 29/40 (2006.01); H01L 21/28 (2006.01);
U.S. Cl.
CPC ...
H01L 21/30608 (2013.01); H01L 21/28035 (2013.01); H01L 21/3086 (2013.01); H01L 29/401 (2013.01); H01L 29/4236 (2013.01);
Abstract

According to an embodiment, an etching method includes forming a first layer on a substrate having a main surface including first and second regions adjacent to each other, the first layer including a portion covering the first region and having a plurality of openings or one or more openings defining a plurality of island-shaped portions, and the first layer further including a portion as a continuous layer covering the second region, forming a catalyst layer an a portion(s) of the main surface exposed in the openings by plating, forming a second layer to cover a portion of the catalyst layer adjacent to a boundary between the first and second regions and expose a portion of the catalyst layer spaced apart from the boundary, and etching the substrate in a presence of the catalyst layer and the second layer.


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