The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2024
Filed:
Aug. 03, 2020
Applicant:
Endress+hauser Se+co. KG, Maulburg, DE;
Inventors:
Assignee:
Endress+Hauser SE+Co. KG, Maulburg, DE;
Primary Examiner:
Int. Cl.
CPC ...
H01H 85/046 (2006.01); H01C 1/144 (2006.01); H01C 1/148 (2006.01); H01H 1/58 (2006.01);
U.S. Cl.
CPC ...
H01H 85/046 (2013.01); H01C 1/144 (2013.01); H01C 1/148 (2013.01); H01H 1/5805 (2013.01); H01H 2001/5888 (2013.01);
Abstract
An SMD-solderable component comprises a resistance element, a first contact element, and a second contact element, wherein the first contact element is connected with a first end section of the resistance element by means of a first soldered connection and the second contact element is connected with a second end section of the resistance element by means of a second soldered connection. At least one of the first soldered connection and the second soldered connection is a lead-free soldered connection that is made with a lead-free solder preform. Further disclosed is a method for producing an SMD-solderable component.