The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2024

Filed:

Jun. 10, 2021
Applicant:

Toyota Jidosha Kabushiki Kaisha, Toyota, JP;

Inventors:

Hiroto Nagaki, Toyota, JP;

Kazumichi Nakatani, Toyota, JP;

Kohei Ishii, Nagoya, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 41/02 (2006.01); B22F 3/03 (2006.01); B22F 7/00 (2006.01); B22F 7/02 (2006.01);
U.S. Cl.
CPC ...
H01F 41/0246 (2013.01); B22F 3/03 (2013.01); B22F 7/008 (2013.01); B22F 7/02 (2013.01); B22F 2301/35 (2013.01); B22F 2302/45 (2013.01);
Abstract

A method for manufacturing a powder magnetic core, the method including: forming a soft magnetic powder (SMP) layer by putting an SMP having a surface on which an insulating coating film is formed into a space surrounded by a lower punch and a die; forming a pressed powder by compressing the SMP layer in the die by the lower punch and an upper punch; and causing the pressed powder and the die to slide relative to each other and then removing the pressed powder from the die is provided. In forming the SMP layer, a different powder different from the SMP is put into the space before and after the SMP is put into the space and a different powder layer having a spring back rate higher than that of the SMP layer by 0.6-1.1% is formed on upper and lower sides of the SMP layer.


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