The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2024

Filed:

Sep. 23, 2021
Applicant:

Amazon Technologies, Inc., Seattle, WA (US);

Inventors:

Kun Tang, Shenzhen, CN;

Fubin Song, Hong Kong, HK;

Chaoran Yang, Shenzhen, CN;

Assignee:

Amazon Technologies, Inc., Seattle, WA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/07 (2006.01); H01L 23/552 (2006.01); H01L 25/065 (2023.01); H01L 21/56 (2006.01); H01L 25/10 (2006.01); H02J 50/10 (2016.01); H01Q 1/22 (2006.01); G06K 19/077 (2006.01); H02J 50/70 (2016.01);
U.S. Cl.
CPC ...
G06K 19/0723 (2013.01); G06K 19/07773 (2013.01); H01L 21/561 (2013.01); H01L 23/552 (2013.01); H01L 25/0655 (2013.01); H01L 25/105 (2013.01); H01Q 1/2225 (2013.01); H01Q 1/2283 (2013.01); H02J 50/10 (2016.02); H02J 50/70 (2016.02); H01L 2225/1023 (2013.01); H01L 2225/1047 (2013.01); H01L 2225/1058 (2013.01);
Abstract

Systems and methods are disclosed for systems-in-packages that have multiple shielding components. In one embodiment, a system-in-package may include a substrate, an integrated circuit package disposed on the substrate, a system-on-a-chip disposed on the substrate, and a molding compound disposed over the integrated circuit package and the system-on-a-chip. The system-in-package may include a first electromagnetic interference shielding component disposed about the molding compound, and a second electromagnetic interference shielding component that at least partially forms an outer surface of the system-in-package. The second electromagnetic interference shielding component may have a patterned structure formed thereon.


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