The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2024

Filed:

Aug. 17, 2021
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Jun Sik Shin, Seoul, KR;

Jong Sik Lee, Seoul, KR;

Jong Tae Kwon, Seoul, KR;

Byung Sook Kim, Seoul, KR;

Jin Gyeong Park, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02F 1/13 (2006.01); G02F 1/1339 (2006.01);
U.S. Cl.
CPC ...
G02F 1/1323 (2013.01); G02F 1/1339 (2013.01);
Abstract

A light path control member according to an embodiment comprises: a first substrate; a first electrode disposed on the first substrate; a second substrate disposed on the first substrate; a second electrode disposed under the second substrate; a light conversion unit disposed between the first electrode and the second electrode; an adhesive layer between the second electrode and the light conversion unit; and a buffer layer between the first electrode and the light conversion unit. The light conversion unit includes a plurality of partition wall portions, a plurality of accommodation portions, and a base portion. The accommodation portions have a light conversion material disposed therein, and include at least two sealing regions formed on at least one of the first substrate or the second substrate. The accommodation portions are arranged to extend in a second direction, and include movement portions connected to the accommodation portions and extending in a first direction different from the second direction. The movement portions are connected to the sealing regions and the accommodation portions. The sealing regions pass through the first substrate, the first electrode, and the buffer layer or through the second substrate, the second electrode, and the adhesive layer. The sealing regions overlap the movement portion.


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