The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2024
Filed:
Nov. 04, 2022
Applicant:
Raytheon Technologies Corporation, Farmington, CT (US);
Inventors:
James F. Wiedenhoefer, Windsor, CT (US);
Russell J. Bergman, South Windsor, CT (US);
William P. Stillman, Westminster, CO (US);
Assignee:
RTX Corporation, Farmington, CT (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21D 53/02 (2006.01); B23P 15/26 (2006.01); F28F 3/04 (2006.01); F28F 3/02 (2006.01); B21D 13/00 (2006.01); B21D 53/04 (2006.01);
U.S. Cl.
CPC ...
F28F 3/046 (2013.01); B21D 13/00 (2013.01); B21D 53/02 (2013.01); B21D 53/022 (2013.01); B23P 15/26 (2013.01); F28F 3/025 (2013.01); B21D 53/04 (2013.01); F28F 2240/00 (2013.01); F28F 2275/04 (2013.01); Y10T 29/4935 (2015.01);
Abstract
A method for forming a heat exchanger plate includes providing a precursor having a body with a first face and a second face opposite the first face and at least one internal passageway; and pluralities of first and second fin precursors respectively protruding from the first and second faces. First and second fin height profiles are formed by removing material from the respective fin precursors via wire electro-discharge machining.