The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2024

Filed:

Dec. 09, 2019
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Robert F. Meyer, Palo Alto, CA (US);

William A. Counts, Sunnyvale, CA (US);

Michael D. Quinones, Campbell, CA (US);

Jason P. Shannon, Sunnyvale, CA (US);

David A. Pakula, San Francisco, CA (US);

Assignee:

APPLE INC., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29D 22/00 (2006.01); F28F 21/02 (2006.01); F28F 21/08 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
F28F 21/02 (2013.01); F28F 21/081 (2013.01); F28F 21/085 (2013.01); H05K 7/20436 (2013.01); H05K 7/20472 (2013.01); H05K 7/20481 (2013.01); H05K 7/20509 (2013.01);
Abstract

An electronic device can include a housing and a support component joined to the housing. The support component can include a thermal conduction layer defining a first surface and a second surface opposite the first surface. The support component can also include a first support layer overlying the first surface and a second support layer overlying the second surface. A ratio of the thickness of the thermal conduction layer to the combined thickness of the first support layer and the second support layer can be at least 1.5.


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