The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2024

Filed:

Mar. 17, 2021
Applicant:

Kokusai Electric Corporation, Tokyo, JP;

Inventors:

Hidenari Yoshida, Toyama, JP;

Takafumi Sasaki, Toyama, JP;

Yusaku Okajima, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/458 (2006.01); C23C 16/34 (2006.01); C23C 16/44 (2006.01); H01L 21/3205 (2006.01);
U.S. Cl.
CPC ...
C23C 16/4588 (2013.01); C23C 16/34 (2013.01); C23C 16/4412 (2013.01); H01L 21/32051 (2013.01);
Abstract

Described herein is a technique capable of adjusting a balance in film thickness between surfaces of a plurality of substrates stacked in a process chamber. According to one aspect of the technique, there is provided a method of manufacturing a semiconductor device, including: a process chamber capable of accommodating a plurality of substrates; a gas supplier configured to supply a process gas to the plurality of the substrates in the process chamber; a gas exhauster configured to discharge the process gas from the process chamber; and a plurality of disks interposed between the plurality of the substrates, respectively, and in vicinity of back surfaces of the plurality of the substrates.


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