The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2024
Filed:
Nov. 22, 2017
Applicant:
Tesa SE, Norderstedt, DE;
Inventors:
Uwe Schümann, Pinneberg, DE;
Clementine Pradier, Sainte Foy les Lyon, FR;
Assignee:
TESA SE, Norderstedt, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 4/06 (2006.01); C09J 7/38 (2018.01); C08K 3/20 (2006.01); C08K 5/14 (2006.01); C08K 5/17 (2006.01); C08K 5/56 (2006.01); C08L 39/06 (2006.01); C08L 75/04 (2006.01);
U.S. Cl.
CPC ...
C09J 4/06 (2013.01); C09J 7/385 (2018.01); C08K 3/20 (2013.01); C08K 5/14 (2013.01); C08K 5/17 (2013.01); C08K 5/56 (2013.01); C08L 39/06 (2013.01); C08L 75/04 (2013.01); C09J 2203/00 (2013.01); C09J 2301/408 (2020.08);
Abstract
The present invention relates to a reactive adhesive film comprising (a) a polymeric film-forming matrix, (b) at least one reactive monomer or reactive resin, and (c) a reagent selected from an initiator, in particular a radical initiator, or an activator, featuring enhanced heat-and-humidity resistance, and to a reactive 2-component adhesive system in film form for bonding diverse materials, such as, for example, metal, wood, glass and/or plastic material.