The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2024
Filed:
Oct. 21, 2019
Applicant:
Industrial Technology Research Institute, Hsinchu, TW;
Inventors:
Hsin-Chieh Lin, Taoyuan, TW;
Chih Chang, Taichung, TW;
Chin Pen Lai, Minxiong Township, TW;
Wang-Chin Cheng, Zhubei, TW;
Assignee:
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 5/16 (2006.01); H01B 1/12 (2006.01); C08G 61/12 (2006.01); C09D 165/00 (2006.01); C09D 5/24 (2006.01); C12Q 1/00 (2006.01); A61B 5/1486 (2006.01); A61B 5/145 (2006.01); A61N 1/05 (2006.01); C25D 9/02 (2006.01); H01B 5/00 (2006.01);
U.S. Cl.
CPC ...
C09D 5/1662 (2013.01); A61B 5/14532 (2013.01); A61B 5/14865 (2013.01); A61N 1/05 (2013.01); C08G 61/126 (2013.01); C09D 5/24 (2013.01); C09D 165/00 (2013.01); C12Q 1/005 (2013.01); C25D 9/02 (2013.01); H01B 1/127 (2013.01); H01B 5/002 (2013.01); C08G 2261/1424 (2013.01); C08G 2261/3223 (2013.01); C08G 2261/344 (2013.01); C08G 2261/51 (2013.01); C08G 2261/94 (2013.01);
Abstract
A modified conductive structure includes a conductive substrate and a polymer film disposed over a surface of the polymer film. A chemical bond exists between the polymer film and the conductive substrate, and the polymer film includes repeating units as shown below: