The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2024

Filed:

Jun. 24, 2022
Applicant:

Elite Electronic Material (Kunshan) Co., Ltd., Kunshan, CN;

Inventors:

Chenyu Shen, Kunshan, CN;

Rongtao Wang, Kunshan, CN;

Xing He, Kunshan, CN;

Penghui Fu, Kunshan, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 136/06 (2006.01); C08K 5/3432 (2006.01); C08K 5/3415 (2006.01); C08K 5/5399 (2006.01);
U.S. Cl.
CPC ...
C08F 136/06 (2013.01); C08K 5/3415 (2013.01); C08K 5/3432 (2013.01); C08K 5/5399 (2013.01);
Abstract

A resin composition includes the following components or a prepolymer thereof: (A) 100 parts by weight of a polyolefin; and (B) 10 parts by weight to 50 parts by weight of a compound of Formula (1) having a pH value of 10 or less. In Formula (1), n is an integer of 3 to 6, each Y and Z are independently selected from o-vinylphenoxy group and phenoxy group, and each Y and Z are not phenoxy group at the same time. The prepolymer is prepared by subjecting a mixture to a prepolymerization reaction, and the mixture at least comprises the component (A) and the component (B). An article is made from the resin composition. The article includes a prepreg, a resin film, a laminate or a printed circuit board and achieves improvements in one or more properties including resin filling uniformity, dissipation factor variation rate under heat, glass transition temperature, Z-axis ratio of thermal expansion, peeling strength and thermal resistance after moisture absorption.


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