logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11897261 B1

PDFFull Text
Date of Patent:
Feb. 13, 2024

Filed:

Mar. 21, 2023

Head and printer

Applicant:

Brother Kogyo Kabushiki Kaisha, Nagoya, JP;

Inventor:

Toru Yamashita, Nagoya, JP;

Assignee:

Brother Kogyo Kabushiki Kaisha, Nagoya, JP;

Attorney:

Banner & Witcoff, Ltd.

Primary Examiner:

Kristal Feggins

Int. Cl.
CPC ...
B41J 2/045 (2006.01); B41J 2/14 (2006.01); H01L 23/50 (2006.01); H01L 23/528 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
B41J 2/04541 (2013.01); B41J 2/04581 (2013.01); B41J 2/14201 (2013.01); B41J 2/14233 (2013.01); H01L 23/50 (2013.01); H01L 23/5286 (2013.01); H01L 23/5386 (2013.01); H01L 23/5387 (2013.01); H01L 25/0655 (2013.01); B41J 2002/14241 (2013.01); B41J 2002/14491 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15323 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/351 (2013.01); H01L 2924/3511 (2013.01);
Abstract

A head includes: a head unit; and a wiring film configured to be connected to the head unit. The wiring film includes: a flexible substrate; a first IC provided on the flexible substrate; a second IC provided on the flexible substrate; a first wire provided on the flexible substrate to connect the first IC and a first contact portion of the head unit; a second wire provided on the flexible substrate to connect the second IC and a second contact portion of the head unit; and a third wire provided on the flexible substrate. The first IC has a long side extended in a predetermined direction and connected to the first wire, the second IC has a long side extended in the predetermined direction and connected to the second wire, and the first IC and the second IC are aligned along the predetermined direction to be apart from each other.

Find Patent Forward Citations

Yamashita, Toru. (2024). Head and printer (U.S. Patent No. 11897261). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11897261

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…