The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2024
Filed:
Feb. 20, 2020
The Boeing Company, Chicago, IL (US);
Weidong Song, Woodinville, WA (US);
The Boeing Company, Arlington, VA (US);
Abstract
Needle arrays for forming ultrasonic perforations may be formed from additive manufacturing and with non-circular cross-sectional areas for forming a plurality of holes, or perforations, in a thin sheet material. Methods of forming a plurality of perforations in a thin sheet of a composite material may include positioning the thin sheet under the needle array, repeatedly contacting the surface of the thin sheet to form perforations therein, translating the thin sheet and/or the needle array such that a different area of the thin sheet is positioned under the needle array, and again repeatedly contacting the surface of the thin sheet to form the perforations therein. Related systems may include an ultrasonic actuator, a needle array, and a remote heating unit configured to heat the workpiece while the perforations are formed therein.