The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2024

Filed:

Jun. 30, 2022
Applicant:

University of Maryland, College Park, College Park, MD (US);

Inventors:

Yongwan Park, Palo Alto, CA (US);

Shiladri Chakraborty, Calcutta, IN;

Alireza Khaligh, Arlington, VA (US);

Assignee:

University of Maryland, College Park, College Park, MD (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/36 (2006.01); H05K 3/34 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H05K 1/144 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); H05K 3/341 (2013.01); H05K 3/36 (2013.01); H01L 23/473 (2013.01);
Abstract

A hybrid double-sided power switch module comprises a double PCB assembly with switch dies and conductive spacers disposed at both sides of the double PCB assembly in different topologies. The gate connections of the switch dies are enhanced by spring pins soldered in the THVs formed through the PCBs in alignment with the gate terminals. MFCs are positioned at both sides of the double PCBs assembly in contact with the tops of the switch dies and conductive spacers with fuzz buttons serving as contacts between the MFCs and the switch dies and spacers. MFCs serve different functions including AC bus-bars, DC bus-bars, heat-sinks, and their combination. The module can withstand external stress and is fabricated by a simplified and inexpensive process requiring only two solder pastes.


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