The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2024

Filed:

Mar. 04, 2021
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Masashi Sasagawa, Yokohama, JP;

Masaki Ono, Yokohama, JP;

Masayuki Otawara, Yokohama, JP;

Nobuharu Nishikoori, Yokohama, JP;

Taro Yoshida, Yokohama, JP;

Tomoyuki Kanagawa, Yokohama, JP;

Yutaka Yagi, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B 6/08 (2006.01); H05B 6/12 (2006.01);
U.S. Cl.
CPC ...
H05B 6/08 (2013.01); H05B 6/1272 (2013.01); H05B 2213/05 (2013.01);
Abstract

An induction heating apparatus is provided. The induction heating apparatus includes a heating coil configured to heat an object to be heated, a full-bridge type inverter configured to supply power to the heating coil, a capacitor provided between an intermediate node of one arm of the inverter and one end of the heating coil, and a first relay provided between the intermediate node and the other end of the heating coil. An intermediate node of the other arm of the inverter and an intermediate point of the heating coil are connected through a first wire. The induction heating apparatus includes a processor configured to open or close the first relay based on an impedance of the object to be heated.


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