The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2024

Filed:

Jun. 06, 2022
Applicant:

Watlow Electric Manufacturing Company, St. Louis, MO (US);

Inventors:

Kevin Ptasienski, O'Fallon, MO (US);

Stanton Hopkins Breitlow, Winona, MN (US);

Mohammad Nosrati, Redwood City, CA (US);

Kevin Smith, Columbia, MO (US);

Brittany Phillips, St. Louis, MO (US);

Ken Ames, San Jose, CA (US);

Patrick Margavio, Columbia, MO (US);

Kurt English, Columbia, MO (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B 3/06 (2006.01); H05B 3/28 (2006.01); H05B 1/02 (2006.01); H01L 21/67 (2006.01); H01L 23/522 (2006.01); H01L 23/485 (2006.01); C23C 16/458 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H05B 3/06 (2013.01); C23C 16/4586 (2013.01); H01L 21/67103 (2013.01); H01L 21/67109 (2013.01); H01L 21/67248 (2013.01); H01L 21/68735 (2013.01); H01L 21/68757 (2013.01); H01L 23/485 (2013.01); H01L 23/522 (2013.01); H05B 1/0202 (2013.01); H05B 1/0233 (2013.01); H05B 3/28 (2013.01); H05B 2203/005 (2013.01); H05B 2203/007 (2013.01); H05B 2203/014 (2013.01); H05B 2203/016 (2013.01); H05B 2203/035 (2013.01);
Abstract

A support pedestal includes a support member including a resistive layer having a plurality of zones, a routing layer, and a plurality of conductive vias. The plurality of zones are defined by a plurality of independently controllable resistive heating elements. The resistive layer and the routing layer are disposed in different planes of the support member and are connected by the plurality of conductive vias.


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