The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2024

Filed:

Aug. 04, 2022
Applicant:

Aac Microtech (Changzhou) Co., Ltd., Changzhou, CN;

Inventors:

Yu Shen, Shenzhen, CN;

Shiyang Cheng, Shenzhen, CN;

Yiwei Zhou, Shenzhen, CN;

Qiang Dan, Shenzhen, CN;

Yang Li, Shenzhen, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 19/02 (2006.01); H04R 1/28 (2006.01);
U.S. Cl.
CPC ...
H04R 19/02 (2013.01); H04R 1/2811 (2013.01); H04R 2201/003 (2013.01); H04R 2499/11 (2013.01);
Abstract

A MEMS speaker includes a substrate, a vibration sounding portion and a baffle plate with a through hole. The baffle plate, the substrate and the vibration sounding portion form a sounding inner cavity, and a volume of the sounding inner cavity can adjust a resonant frequency of the sounding inner cavity, so that the resonance frequency of the sounding inner cavity resonate with a preset frequency of the MEMS speaker. A speaker assembly structure further provided includes a speaker, a fixing portion, and a baffle plate, the speaker and the baffle plate together enclose and form a sounding inner cavity, the fixing portion and the speaker are fixedly connected together and form a sealing structure. A sound pressure level of the MEMS speaker and the speaker assembly structure is high and harmonic distortion of the MEMS speaker and the speaker assembly structure is small.


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