The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2024

Filed:

Sep. 25, 2020
Applicant:

Alarm.com Incorporated, Tysons, VA (US);

Inventors:

Charles Richard Alpert, Snoqualmie, WA (US);

Roy Franklin Perry, Niwot, CO (US);

Assignee:

Alarm.com Incorporated, Tysons, VA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/16 (2006.01); H04B 3/54 (2006.01); H01R 13/639 (2006.01); H01R 13/73 (2006.01); G06Q 50/06 (2012.01); H04L 12/28 (2006.01);
U.S. Cl.
CPC ...
H04B 3/546 (2013.01); G06Q 50/06 (2013.01); H01R 13/6395 (2013.01); H01R 13/73 (2013.01); H04L 12/2803 (2013.01); H04L 2012/2841 (2013.01); H04L 2012/2843 (2013.01);
Abstract

Methods, systems, and apparatus, including computer programs encoded on computer-storage media, for modular electrical grid communications platform. In some implementations, a devices includes a housing that forms an interior space, and that includes an exterior surface, one or more pass-through regions that each define a through-hole between the interior space and the exterior surface, and a recess at the exterior surface that is capable of receiving a module. The device includes a printed circuit board disposed within the interior space of the housing. The devices includes a module that has at least one sensor and that is placed in the recess. The device includes electrical connections that each have a first end connected to the printed circuit board, and a second end that directly or indirectly contacts a corresponding component of the module.


Find Patent Forward Citations

Loading…