The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2024
Filed:
May. 16, 2022
Applicant:
Lumentum Operations Llc, San Jose, CA (US);
Inventors:
Christoffer Stroemberg, Schlieren, CH;
Susan Fung, San Jose, CA (US);
Derek A. Tucker, San Jose, CA (US);
Assignee:
Lumentum Operations LLC, San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 3/04 (2006.01); H05K 5/06 (2006.01); H01S 3/16 (2006.01); H01S 3/06 (2006.01); H01S 3/067 (2006.01); H01S 5/02 (2006.01); H01S 3/02 (2006.01); H01S 5/50 (2006.01);
U.S. Cl.
CPC ...
H01S 3/0405 (2013.01); H01S 3/025 (2013.01); H01S 3/061 (2013.01); H01S 3/0615 (2013.01); H01S 3/0623 (2013.01); H01S 3/06754 (2013.01); H01S 3/1643 (2013.01); H01S 5/0216 (2013.01); H01S 5/50 (2013.01); H05K 5/06 (2013.01);
Abstract
An amplifier assembly may include a first heat sink plate that includes a first channel, a second heat sink plate that includes a second channel, and an amplifier rod disposed in the first channel and the second channel. The second heat sink plate may be connected with the first heat sink plate such that the first channel and the second channel align. The amplifier rod may be connected to the first heat sink plate and the second heat sink plate by a non-eutectic solder.