The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2024
Filed:
Mar. 09, 2021
Electrical interconnect with conductive polymer contacts having tips with different shapes and sizes
Te Connectivity Services Gmbh, Schaffhausen, CH;
Tyco Electronics Japan G.k., Kawasaki, JP;
John Joseph Consoli, Harrisburg, PA (US);
Chad William Morgan, Carneys Point, NJ (US);
Megan Hoarfrost Beers, Redwood City, CA (US);
Christopher William Blackburn, Bothell, WA (US);
Nathan Lincoln Tracy, Harrisburg, PA (US);
Jennifer Love, Enola, PA (US);
Clarence Leon Yu, Sacramento, CA (US);
Shinichi Hashimoto, Kangawa, JP;
Hiroshi Shirai, Kangawa, JP;
TYCO ELECTRONICS JAPAN G.K., Kawasaki, JP;
TE CONNECTIVITY SOLUTIONS GmbH, Schaffhausen, CH;
Abstract
A socket assembly includes an electrical interconnect having an insulator having apertures. The electrical interconnect includes primary contacts and secondary contacts received in corresponding apertures. The primary contacts include a primary conductive polymer column having upper contact tips and lower contact tips for electrically interconnecting first and second electronic packages. The secondary contacts include a secondary conductive polymer column having upper contact tips and lower contact tips for electrically interconnecting the first and second electronic packages. The contact tips of the secondary conductive polymer columns have a different shape from the shape of the contact tips of the primary conductive polymer columns.