The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2024

Filed:

Jul. 01, 2020
Applicant:

Creeled, Inc., Durham, NC (US);

Inventors:

Robert Wilcox, Rolesville, NC (US);

Derek Miller, Raleigh, NC (US);

Kyle Damborsky, Apex, NC (US);

Aaron Francis, Apex, NC (US);

Colin Blakely, Raleigh, NC (US);

Assignee:

CreeLED, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/58 (2010.01); H01L 33/64 (2010.01); H01L 33/62 (2010.01); H01L 33/56 (2010.01);
U.S. Cl.
CPC ...
H01L 33/58 (2013.01); H01L 33/62 (2013.01); H01L 33/642 (2013.01); H01L 33/56 (2013.01);
Abstract

Solid-state lighting devices including light-emitting diodes (LEDs) and lens arrangements for packaged LED devices are disclosed. An LED package may include one or more LED chips on a submount with a lens positioned on the submount to form a cavity. The one or more LED chips may reside in the cavity without direct encapsulation materials that would otherwise contact the one or more LED chips and any corresponding wirebonds. In this manner, the one or more LED chips may be driven with higher drive currents while reducing degradation and mechanical strain effects related to differences in coefficients of thermal expansion with typical encapsulant materials. LED packages may also be configured with one or more apertures that allow air flow between an interior volume of a cavity and an ambient environment outside the LED package to promote heat dissipation at higher drive currents.


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