The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2024

Filed:

Sep. 02, 2020
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Zhiwei Liang, Beijing, CN;

Wenqian Luo, Beijing, CN;

Guoqiang Wang, Beijing, CN;

Yingwei Liu, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/16 (2023.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 24/03 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/81 (2013.01); H01L 27/124 (2013.01); H01L 27/1259 (2013.01); H01L 2224/0382 (2013.01); H01L 2224/10122 (2013.01); H01L 2224/1182 (2013.01); H01L 2224/13007 (2013.01); H01L 2224/13016 (2013.01); H01L 2224/13078 (2013.01); H01L 2224/81201 (2013.01);
Abstract

The present disclosure provides a driving substrate and a manufacturing method thereof, and a micro LED bonding method. The driving substrate includes: a base substrate; a driving function layer provided on the base substrate, and including a plurality of driving thin film transistors and a plurality of common electrode lines; a pad layer including a plurality of pads provided on a side of the driving function layer away from the base substrate, each pad including a pad body and a microstructure of hard conductive material provided on a side of the pad body away from the base substrate; and a plurality of buffer structures provided on the side of the driving function layer away from the base substrate, each buffer structure surrounding a portion of a corresponding microstructure close to the base substrate, and a height of the buffer structure being lower than a height of the microstructure.


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