The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2024
Filed:
Jun. 03, 2021
Applicant:
Japan Display Inc., Tokyo, JP;
Inventors:
Assignee:
Japan Display Inc., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 25/16 (2023.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/80 (2013.01); H01L 24/08 (2013.01); H01L 25/167 (2013.01); H01L 33/62 (2013.01); H01L 24/05 (2013.01); H01L 2224/05611 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/08502 (2013.01); H01L 2224/80004 (2013.01); H01L 2224/80024 (2013.01); H01L 2224/8085 (2013.01); H01L 2224/80224 (2013.01); H01L 2224/80805 (2013.01); H01L 2224/80907 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/1426 (2013.01);
Abstract
A method for manufacturing a display device includes preparing a circuit board including a drive circuit for driving a LED chip, forming a connecting electrode on the circuit board, forming an adhesive layer on the connecting electrode, adhering a terminal electrode of the LED chip on the adhesive layer and joining the connecting electrode and the terminal electrode by irradiating a laser light. The adhesive layer may be formed only on a upper surface of the connecting electrode.