The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2024
Filed:
Dec. 13, 2021
Juniper Networks, Inc., Sunnyvale, CA (US);
Mokshith Tejasvi, Bangalore, IN;
Saravanan Govindasamy, Bangalore, IN;
Girish Muddenahalli Haleshappa, Bangalore, IN;
Raveen Jagadeesan, Bangalore, IN;
Juniper Networks, Inc., Sunnyvale, CA (US);
Abstract
A semiconductor package may include a substrate, an application-specific integrated circuit (ASIC) provided on a first portion of a surface of the substrate, a memory device provided on a second portion of the surface of the substrate, and a stiffener plate provided on a third portion of the surface of the substrate. The stiffener plate may be spaced from and may surround the ASIC and the memory device. The semiconductor package may include an electromagnetic interference (EMI) absorber provided on a fourth portion of the surface of the substrate. The EMI absorber may be provided between the stiffener plate and the ASIC and the memory device. The EMI absorber may surround the ASIC and the memory device and may block EMI radiation generated by the ASCI and the memory device.