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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11894195 B1

PDFFull Text
Date of Patent:
Feb. 06, 2024

Filed:

Nov. 08, 2021

Electronic component

Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Yoji Tozawa, Tokyo, JP;

Masashi Shimoyasu, Tokyo, JP;

Makoto Yoshino, Tokyo, JP;

Takuo Abe, Tokyo, JP;

Akihiko Oide, Tokyo, JP;

Tsutomu Ono, Tokyo, JP;

Shinichi Sato, Tokyo, JP;

Makoto Morita, Tokyo, JP;

Shinichi Sato, Tokyo, JP;

Hidekazu Sato, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Tuyen T Nguyen

Int. Cl.
CPC ...
H01F 27/32 (2006.01); H01F 27/29 (2006.01); H01G 4/232 (2006.01); H01G 4/252 (2006.01); H01G 13/00 (2013.01); H05K 1/03 (2006.01); H01B 1/22 (2006.01); H01G 4/30 (2006.01); H03H 7/42 (2006.01); H01F 17/00 (2006.01); H01G 4/12 (2006.01); H03H 1/00 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01G 4/2325 (2013.01); H01B 1/22 (2013.01); H01F 17/0013 (2013.01); H01F 27/29 (2013.01); H01F 27/292 (2013.01); H01F 27/32 (2013.01); H01F 27/324 (2013.01); H01G 4/232 (2013.01); H01G 4/252 (2013.01); H01G 4/30 (2013.01); H01G 13/006 (2013.01); H03H 7/427 (2013.01); H05K 1/0306 (2013.01); H01F 2017/0066 (2013.01); H01F 2017/0093 (2013.01); H01G 4/12 (2013.01); H03H 2001/0057 (2013.01); H03H 2001/0085 (2013.01); H05K 3/3442 (2013.01); H05K 2201/1006 (2013.01); H05K 2201/10636 (2013.01);
Abstract

An electronic component includes an element body, an external electrode, and a resin film having electrical insulation properties. The element body includes a principal surface and a side surface adjacent to the principal surface. The external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the side surface. The resin film is disposed on the principal surface and is in contact with the principal surface. Each of the first electrode portion and the second electrode portion includes a conductive resin layer disposed on the element body. A conductive resin layer included in the first electrode portion is disposed on the resin film and is in contact with the resin film.

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