The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2024
Filed:
Mar. 09, 2023
Tdk Corporation, Tokyo, JP;
Takahiro Kawahara, Tokyo, JP;
Manabu Ohta, Tokyo, JP;
Kenei Onuma, Tokyo, JP;
Yuuya Kaname, Tokyo, JP;
Ryo Fukuoka, Tokyo, JP;
Hokuto Eda, Tokyo, JP;
Masataro Saito, Tokyo, JP;
Kohei Takahashi, Tokyo, JP;
TDK CORPORATION, Tokyo, JP;
Abstract
In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.