The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2024
Filed:
Jun. 03, 2022
Applicant:
Acacia Communications, Inc., Maynard, MA (US);
Inventor:
Christopher Doerr, Middleton, NJ (US);
Assignee:
ACACIA COMMUNICATIONS, INC., Maynard, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); G02B 6/30 (2006.01); G02B 6/36 (2006.01); G02B 6/44 (2006.01);
U.S. Cl.
CPC ...
G02B 6/423 (2013.01); G02B 6/30 (2013.01); G02B 6/3616 (2013.01); G02B 6/428 (2013.01); G02B 6/4272 (2013.01); G02B 6/4202 (2013.01); G02B 6/4204 (2013.01); G02B 6/424 (2013.01); G02B 6/4232 (2013.01); G02B 6/4245 (2013.01); G02B 6/4249 (2013.01); G02B 6/4267 (2013.01); G02B 6/4269 (2013.01); G02B 6/4273 (2013.01); G02B 6/4457 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/73253 (2013.01);
Abstract
A photonic integrated circuit may be coupled to an optical fiber and packaged. The optical fiber may be supported by a fiber holder during a solder reflow process performed to mount the packaged photonic integrated circuit to a circuit board or other substrate. The optical fiber may be decoupled from the fiber holder, and the fiber holder removed, after completion of the solder reflow process.