The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2024

Filed:

Sep. 30, 2022
Applicant:

China University of Petroleum (East China), Qingdao, CN;

Inventors:

Liyun Fu, Qingdao, CN;

Qingqing Li, Qingdao, CN;

Qizhen Du, Qingdao, CN;

Zhiwei Wang, Qingdao, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01V 1/28 (2006.01); G01V 1/36 (2006.01);
U.S. Cl.
CPC ...
G01V 1/282 (2013.01); G01V 1/362 (2013.01); G01V 2210/512 (2013.01); G01V 2210/67 (2013.01);
Abstract

This disclosure relates to geophysical exploration and seismic imaging, and more particularly to a seismic imaging method, system, and device based on pre-stack high-angle fast Fourier transform (FFT). The method includes: acquiring seismic data acquired during seismic exploration; extracting a common shot point gather from the seismic data followed by conversion into a frequency wavenumber domain common offset gather; calculating wave propagation angles; dividing an imaging region into a first region and a second region; solving constant coefficients of the first region and the second region; performing frequency-division layer-by-layer wavefield continuation on a frequency-wave number domain common offset gather to obtain imaging results at different depths and frequencies; subjecting the imaging results to integration followed by transformation to a spatial domain to obtain common offset imaging profiles; and subjecting the common offset imaging profiles to superposition obtain final imaging results. The disclosure achieves the highly-precise seismic imaging of high-steep structures and improves imaging efficiency.


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