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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11891512 B1

PDFFull Text
Date of Patent:
Feb. 06, 2024

Filed:

Oct. 03, 2022

Redox curable compositions and methods of manufacture thereof

Applicant:

Henkel Ag & Co. Kgaa, Duesseldorf, DE;

Inventors:

Nigel Sweeney, Dublin, IE;

Mark Loane, Naas, IE;

Brendan Kneafsey, Lucan, IE;

Rory Barnes, Lucan, IE;

Assignee:

Henkel AG & Co. KGaA, Duesseldorf, DE;

Attorney:

Steven C. Bauman

Primary Examiner:

Michael M Dollinger

Int. Cl.
CPC ...
C08L 75/16 (2006.01); B32B 7/12 (2006.01); B32B 37/06 (2006.01); B32B 37/10 (2006.01); B32B 37/18 (2006.01); C09J 175/16 (2006.01); B32B 15/088 (2006.01); B32B 15/18 (2006.01); B32B 27/08 (2006.01); B32B 27/20 (2006.01); B32B 27/34 (2006.01); B32B 37/12 (2006.01); C09J 175/04 (2006.01);
U.S. Cl.
CPC ...
C08L 75/16 (2013.01); B32B 7/12 (2013.01); B32B 37/06 (2013.01); B32B 37/10 (2013.01); B32B 37/18 (2013.01); C09J 175/16 (2013.01); B32B 15/088 (2013.01); B32B 15/18 (2013.01); B32B 27/08 (2013.01); B32B 27/20 (2013.01); B32B 27/34 (2013.01); B32B 2037/1253 (2013.01); B32B 2255/06 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2262/101 (2013.01); B32B 2307/54 (2013.01); B32B 2309/04 (2013.01); B32B 2309/12 (2013.01); B32B 2311/30 (2013.01); B32B 2377/00 (2013.01); C09J 175/04 (2013.01);
Abstract

A redox curable composition, methods for manufacturing same and uses thereof are disclosed. The redox curable composition is useful as a pre-applied adhesive. The redox curable composition is solid at room temperature, may be heated for application to a substrate, and cools to form a dry-to-touch adhesive layer on said substrate, which may be activated when required by mating with another substrate and exposure to an anaerobic environment. The composition is particularly suited to manufacturing complex products, such as mobile phones, computers and circuits.

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