The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2024
Filed:
Feb. 15, 2019
Applicant:
Zeon Corporation, Tokyo, JP;
Inventors:
Ayako Kato, Tokyo, JP;
Shinsuke Miyazawa, Tokyo, JP;
Assignee:
ZEON CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/18 (2006.01); B29C 55/02 (2006.01); C08G 61/08 (2006.01); H01G 4/18 (2006.01);
U.S. Cl.
CPC ...
C08J 5/18 (2013.01); B29C 55/02 (2013.01); C08G 61/08 (2013.01); H01G 4/18 (2013.01); C08G 2261/3325 (2013.01); C08G 2261/50 (2013.01); C08G 2261/90 (2013.01); C08J 2345/00 (2013.01);
Abstract
Provided is a film for a capacitor that can improve dielectric strength retention at high temperatures and can also improve metal vapor deposition properties and formability. The film for a capacitor contains a hydrogenated dicyclopentadiene ring-opened polymer that is crystalline and has a heat shrinkage ratio of not less than 0.01% and not more than 1.0% when heated at 200° C. for 10 minutes, a plane orientation factor of 0.01 or more, a density of 1.03×10g/mor more, and a thickness of 15.0 μm or less.