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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11891462 B1

PDFFull Text
Date of Patent:
Feb. 06, 2024

Filed:

Feb. 14, 2020

Photocurable resin composition and 3d stereolithography product using same

Applicant:

Nagase Chemtex Corporation, Osaka, JP;

Inventors:

Koji Watanabe, Tatsuno, JP;

Hiroaki Ozoe, Tatsuno, JP;

Assignee:

Nagase Chemtex Corporation, Osaka, JP;

Attorney:

Stinson LLP

Primary Examiner:

Jessica Whiteley

Int. Cl.
CPC ...
C08F 2/46 (2006.01); C08F 2/50 (2006.01); C08G 61/04 (2006.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); B29C 64/129 (2017.01); C08F 222/10 (2006.01); C08F 220/30 (2006.01); C08F 220/20 (2006.01); C08F 224/00 (2006.01); C08K 3/36 (2006.01); C08K 5/5397 (2006.01); C08K 9/04 (2006.01); B29K 33/00 (2006.01);
U.S. Cl.
CPC ...
C08F 2/50 (2013.01); B29C 64/129 (2017.08); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); C08F 220/20 (2013.01); C08F 220/306 (2020.02); C08F 222/1065 (2020.02); C08F 224/00 (2013.01); C08K 3/36 (2013.01); C08K 5/5397 (2013.01); C08K 9/04 (2013.01); B29K 2033/08 (2013.01); C08K 2201/005 (2013.01); C08K 2201/011 (2013.01);
Abstract

A photocurable resin composition includes a reactive monomer, a reactive oligomer, and a photopolymerization initiator. A cured product of the reactive monomer has a glass transition point of less than 20° C., and a cured product of the reactive oligomer has a glass transition point of less than 20° C. A cured product of the photocurable resin composition has a loss tangent tan δ at 25° C. of 0.2 or less. The cured product of the photocurable resin composition has an elongation at break in accordance with ASTM D638 of 150% or more.

Find Patent Forward Citations

Watanabe, Koji. (2024). Photocurable resin composition and 3d stereolithography product using same (U.S. Patent No. 11891462). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11891462

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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