IDiyas

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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11890853 B1

PDFFull Text
Date of Patent:
Feb. 06, 2024

Filed:

Jan. 19, 2021

Resin layered product, dielectric layer, metal foil with resin, capacitor element, and printed wiring board with built-in capacitor

Applicant:

Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;

Inventors:

Yoshihiro Yoneda, Ageo, JP;

Toshihiro Hosoi, Ageo, JP;

Tetsuro Sato, Ageo, JP;

Assignee:

MITSUI MINING & SMELTING CO., LTD., Tokyo, JP;

Attorney:

GREENBLUM & BERNSTEIN, P.L.C.

Primary Examiner:

John D Freeman

Int. Cl.
CPC ...
B32B 7/025 (2019.01); B32B 15/08 (2006.01); B32B 15/20 (2006.01); B32B 27/28 (2006.01); B32B 27/38 (2006.01);
U.S. Cl.
CPC ...
B32B 7/025 (2019.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); B32B 27/281 (2013.01); B32B 27/38 (2013.01); B32B 2250/02 (2013.01); B32B 2255/06 (2013.01); B32B 2264/102 (2013.01); B32B 2307/204 (2013.01); B32B 2311/12 (2013.01); B32B 2457/08 (2013.01); B32B 2457/16 (2013.01);
Abstract

There is provided a resin laminate including a first layer composed of a first resin composition and a second layer composed of a second resin composition. The first resin composition includes a resin component including an epoxy resin, a diamine compound, and a polyimide resin, and a complex metal oxide including at least two selected from Ba, Ti, etc. of 60 to 85 parts by weight based on 100 parts of the first resin composition, and the content of the polyimide resin is 20 to 60 parts by weight based on 100 parts of the resin component. The second resin composition includes a resin component including an epoxy resin and a diamine compound but is free of polyimide resin, and a complex metal oxide including at least two selected from Ba, Ti, etc. of 70 to 90 parts by weight based on 100 parts of the second resin composition.

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