The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2024

Filed:

May. 18, 2021
Applicant:

The Regents of the University of Michigan, Ann Arbor, MI (US);

Inventors:

Fengchao Liu, Ann Arbor, MI (US);

Pingsha Dong, Ann Arbor, MI (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 43/18 (2006.01); B29C 65/64 (2006.01); B29C 65/00 (2006.01); B29C 43/46 (2006.01); B29C 43/34 (2006.01); B29C 43/14 (2006.01);
U.S. Cl.
CPC ...
B29C 43/183 (2013.01); B29C 43/34 (2013.01); B29C 43/46 (2013.01); B29C 65/64 (2013.01); B29C 66/022 (2013.01); B29C 66/72 (2013.01); B29C 66/742 (2013.01); B29C 43/146 (2013.01);
Abstract

Methods of producing polymer-metal hybrid components that are bonded by C—O-M bonds at the interface using at least one of the hot pressing, rolling, and injection molding methods to create chemical bond formation conditions at the polymer and metal interface. When the thermal cycle and compressive pressure specified herein is combinationally created at the polymer and metal interfaced, strong C—O-M bonds forms at the interface and strongly bonds the metal and polymer together through the reaction carbonyl groups (C═O) in polymer and the metal surface. For polymers lacking enough carbonyl groups, new functional groups can be in-situ generation through introducing distributed air pockets at the polymer-metal interface for forming 3-dimensional distributed C—O-M bonds at the interface.


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