The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2024

Filed:

Dec. 23, 2021
Applicant:

Xerox Corporation, Norwalk, CT (US);

Inventor:

Daniel Bullard, Palo Alto, CA (US);

Assignee:

XEROX CORPORATION, Norwalk, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 10/50 (2021.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01); B33Y 40/20 (2020.01); B22F 10/66 (2021.01); B22F 10/22 (2021.01); B22D 23/00 (2006.01); C23C 8/24 (2006.01);
U.S. Cl.
CPC ...
B22F 10/50 (2021.01); B22D 23/003 (2013.01); B22F 10/22 (2021.01); B22F 10/66 (2021.01); B33Y 10/00 (2014.12); B33Y 40/20 (2020.01); B33Y 80/00 (2014.12); C23C 8/24 (2013.01);
Abstract

An embodiment of the present disclosure is directed to a method of additive manufacturing. The method comprises: i) forming a first layer, the first layer comprising at least one material chosen from an article material, a support structure material and a fracturable material; ii) forming an additional layer on the first layer, the additional layer comprising at least one material chosen from the article material, the support structure material and the fracturable material; and iii) repeating ii) one or more times to form a three-dimensional build comprising an article and at least one support structure attached to the article at an interface, the interface comprising the fracturable material formed during one or more of i), ii) or iii), the fracturable material being formed by exposing a print material with a gas reactant. A three-dimensional build is also disclosed.


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