logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11889731 B1

PDFFull Text
Date of Patent:
Jan. 30, 2024

Filed:

Aug. 01, 2022

Display apparatus

Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Joongsoo Moon, Yongin-si, KR;

Wonkyu Kwak, Yongin-si, KR;

Kwangmin Kim, Yongin-si, KR;

Kiwook Kim, Yongin-si, KR;

Dongsoo Kim, Yongin-si, KR;

Hyunae Park, Yongin-si, KR;

Jieun Lee, Yongin-si, KR;

Changkyu Jin, Yongin-si, KR;

Assignee:

SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do, KR;

Attorney:

CANTOR COLBURN LLP

Primary Examiner:

Michelle Mandala

Int. Cl.
CPC ...
H10K 59/131 (2023.01); H01L 27/12 (2006.01); H10K 59/124 (2023.01); H10K 59/121 (2023.01); H10K 77/10 (2023.01); H01L 49/02 (2006.01); H10K 50/844 (2023.01); H10K 59/122 (2023.01); H10K 59/123 (2023.01); H10K 102/00 (2023.01);
U.S. Cl.
CPC ...
H10K 59/131 (2023.02); H01L 27/1218 (2013.01); H01L 27/1244 (2013.01); H01L 27/1248 (2013.01); H01L 27/1255 (2013.01); H10K 59/124 (2023.02); H10K 59/1213 (2023.02); H10K 59/1216 (2023.02); H10K 77/111 (2023.02); H01L 27/124 (2013.01); H01L 28/60 (2013.01); H10K 50/844 (2023.02); H10K 59/122 (2023.02); H10K 59/123 (2023.02); H10K 2102/311 (2023.02); Y02E 10/549 (2013.01);
Abstract

A display apparatus includes: a substrate having a bending area between a first area and a second area; internal conductive lines on the substrate in the first area; external conductive lines on the substrate in the second area; an organic material layer covering the bending area and covering at least a portion of the internal conductive lines and the external conductive lines; and connection lines on the organic material layer and connecting the internal conductive lines to the external conductive lines, respectively. Organic through-holes are defined through the organic material layer, the connection lines are respectively connected to the internal conductive lines through the organic through-holes, and an upper surface of the organic material layer between the organic through-holes has a convex curved shape.

Find Patent Forward Citations

Loading…