The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2024

Filed:

May. 27, 2020
Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Hwiseong Kim, Seongnam-si, KR;

Donghoo Kim, Cheonan-si, KR;

Hoisoo Kwon, Cheonan-si, KR;

Hee-Won Yoon, Asan-si, KR;

Soojeong Choi, Paju-si, KR;

Gwangjoon Hong, Cheonan-si, KR;

Assignee:

SAMSUNG DISPLAY CO., LTD., Yongin-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10K 59/131 (2023.01); H10K 50/84 (2023.01); H10K 102/00 (2023.01);
U.S. Cl.
CPC ...
H10K 59/131 (2023.02); H10K 50/841 (2023.02); H10K 2102/00 (2023.02);
Abstract

A display device includes: an array substrate including a pixel array disposed on a display area, a first transfer wiring disposed on a peripheral area adjacent to the display area and electrically connected to the pixel array, a second transfer wiring disposed on the peripheral area adjacent to the display area and electrically connected to the pixel array, and a barrier member disposed between the first transfer wiring and the second transfer wiring, the barrier member including an inorganic insulation material; and a sealing member disposed between the array substrate and an encapsulation substrate to combine the array substrate with the encapsulation substrate, the sealing member contacting at least a portion of the first transfer wiring and the second transfer wiring.


Find Patent Forward Citations

Quick Actions:

Kim, Hwiseong. (2024). Display device including a sealing area overlapping transfer wirings (U.S. Patent No. 11889724). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11889724

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