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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11889709 B1

PDFFull Text
Date of Patent:
Jan. 30, 2024

Filed:

Feb. 29, 2016

Mechanically stacked tandem photovoltaic cells with intermediate optical filters

Applicant:

The Regents of the University of Michigan, Ann Arbor, MI (US);

Inventors:

Stephen R. Forrest, Ann Arbor, MI (US);

Kyusang Lee, Ann Arbor, MI (US);

Assignee:

The Regents of the University of Michigan, Ann Arbor, MI (US);

Attorney:

Finnegan, Henderson, Farabow, Garrett & Dunner, LLP

Primary Examiner:

Andrew J Golden

Int. Cl.
CPC ...
H10K 30/20 (2023.01); H01L 31/0687 (2012.01); H01L 31/0725 (2012.01); H01L 31/043 (2014.01); H01L 31/076 (2012.01); H01L 31/0232 (2014.01); H01L 31/078 (2012.01); H10K 30/57 (2023.01); H10K 30/87 (2023.01); H10K 85/20 (2023.01); H01L 31/054 (2014.01); H01L 31/101 (2006.01); H01L 31/0352 (2006.01);
U.S. Cl.
CPC ...
H10K 30/211 (2023.02); H01L 31/02327 (2013.01); H01L 31/035209 (2013.01); H01L 31/035218 (2013.01); H01L 31/043 (2014.12); H01L 31/0547 (2014.12); H01L 31/0687 (2013.01); H01L 31/076 (2013.01); H01L 31/078 (2013.01); H01L 31/0725 (2013.01); H01L 31/1013 (2013.01); H10K 30/57 (2023.02); H10K 30/87 (2023.02); H10K 85/215 (2023.02); H10K 85/211 (2023.02); Y02E 10/52 (2013.01); Y02E 10/544 (2013.01); Y02E 10/548 (2013.01); Y02E 10/549 (2013.01);
Abstract

A method of fabricating a multi-junction photosensitive device is provided. The method may include fabricating at least two photoactive layers, wherein at least one photoactive layer is fabricated on a transparent substrate, and at least one photoactive layer is fabricated on a reflective substrate, patterning at least one optical filter layer on at least one photoactive layer fabricated on a transparent substrate, and bonding the at least two photoactive layers using cold weld or van der Waals bonding. A multi-junction photosensitive device is also provided. The device may have at least two photoactive layers, and at least one optical filter layer, wherein at least two layers are bonded using cold weld or van der Waals bonding. The optical filter layer may be a Distributed Bragg Reflector.

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