The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2024
Filed:
Dec. 18, 2020
Sumitomo Electric Printed Circuits, Inc., Shiga, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
Yoshio Oka, Osaka, JP;
Koji Nitta, Osaka, JP;
Shoichiro Sakai, Osaka, JP;
Yasushi Mochida, Osaka, JP;
Tadahiro Kaibuki, Osaka, JP;
Junichi Okaue, Shiga, JP;
SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., Shiga, JP;
SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka, JP;
Abstract
A flexible printed circuit board includes a base film having an insulating property, and one or more interconnects laminated to at least one surface side of the base film. At least one of the one or more interconnects includes, in a longitudinal direction, a first portion and a second portion that is a portion other than the first portion, an average thickness of the second portion being greater than an average thickness of the first portion. A ratio of the average thickness of the second portion to the average thickness of the first portion is greater than or equal to 1.5 and less than or equal to 50.