The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2024
Filed:
Jan. 29, 2021
Applicant:
Kaneka Corporation, Osaka, JP;
Inventor:
Shusuke Yoshihara, Hyogo, JP;
Assignee:
KANEKA CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); C08L 9/00 (2006.01); C08L 51/04 (2006.01); C08L 63/00 (2006.01); C08L 71/12 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0366 (2013.01); C08L 9/00 (2013.01); C08L 51/04 (2013.01); C08L 63/00 (2013.01); C08L 71/123 (2013.01); C08L 2207/53 (2013.01);
Abstract
A metal-clad laminate and techniques using the metal-clad laminate are provided where the metal-clad laminate has excellent adhesiveness between a substrate and metal foil in addition to good dielectric characteristics and heat resistance. The metal-clad laminate includes an insulating layer in contact with metal foil where the insulating layer further includes a resin composition and a fibrous base material. The resin composition contains a specific resin (A) and specific core-shell polymer particles (B), and a surface of the metal foil has a ten-point average roughness (Rz) of not more than 2.0 μm.