The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2024

Filed:

Sep. 01, 2022
Applicant:

Baidu Usa Llc, Sunnyvale, CA (US);

Inventors:

Zhenwei Yu, Sunnyvale, CA (US);

Yun Ji, San Jose, CA (US);

Assignee:

BAIDU USA LLC, Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/42 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0237 (2013.01); H05K 1/116 (2013.01); H05K 3/42 (2013.01); H05K 2201/09627 (2013.01); H05K 2201/09672 (2013.01);
Abstract

A printed circuit board includes first and second surfaces, first and second layers, and first and second vias. The first via extends from a first layer to the second surface and includes a first portion that is on a conductive path between the first layer and the second layer and a second portion that is not on the conductive path. A length of the first portion of the first via is greater than that of the second portion of the first via. The second via extends from the second surface to the second layer. The second via includes a first portion that is on the conductive path between the first layer and the second layer and a second portion that is not on the conductive path. A length of the first portion of the second via is greater than that of the second portion of the second via.


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