The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2024
Filed:
Mar. 09, 2021
Mitsubishi Electric Corporation, Tokyo, JP;
Masatoshi Toyonaga, Tokyo, JP;
Satoru Ishizaka, Tokyo, JP;
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Abstract
In a circuit board (A), a first capacitor () extends from a wiring pattern () to a region located on one side of the wiring pattern () in the width direction. A second capacitor () extends from the wiring pattern () to a region located on the other side of the wiring pattern () in the width direction. With a semiconductor device () mounted on the circuit board (A), a power supply terminal () is electrically connected to the wiring pattern (). The semiconductor device (), the wiring pattern (), the first capacitor (), a first interlayer joint (), a ground plane (), and a third interlayer joint () constitute a first closed circuit. The semiconductor device (), the wiring pattern (), the second capacitor (), a second interlayer joint (), the ground plane (), and the third interlayer joint () constitute a second closed circuit.