The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2024

Filed:

May. 27, 2022
Applicant:

Aac Acoustic Technologies (Shenzhen) Co., Ltd., Shenzhen, CN;

Inventors:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 7/06 (2006.01); H04R 7/18 (2006.01); B81B 3/00 (2006.01); H04R 19/04 (2006.01);
U.S. Cl.
CPC ...
H04R 7/06 (2013.01); B81B 3/0021 (2013.01); H04R 7/18 (2013.01); H04R 19/04 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/019 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/04 (2013.01); B81B 2207/07 (2013.01); H04R 2201/003 (2013.01); H04R 2410/03 (2013.01);
Abstract

Provided is a MEMS device. The MEMS device includes: substrate having back cavity passing therethrough; diaphragm connected to the substrate and covers the back cavity, the diaphragm comprises first and second membranes, and accommodating space is formed between the first and second membranes; supports arranged in the accommodating space, and opposite ends of the support are connected to the first and second membranes; counter electrode arranged in the accommodating space, the first and second membranes each include conductive and second regions, the second region is formed by semiconductor material without doping conductive ions. Through design of the first and second membranes as the first region and the second region, respectively, the second region is formed by semiconductor material without doping conductive ions, and the first region is formed by doping conductive ions in the semiconductor material, so that the compliance performance is improved and not at risk of delamination.


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